Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
Jeehoo Na; Eunhye Lee; Kyung‐Ho Park; Dongwoo Lee; Tae‐Ik Lee
- Published
- Publisher
- Wiley
- Journal / collection
- Advanced Materials Technologies
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1002/admt.202401184
The original publisher provides the full text and its access options.
Cite this source
Jeehoo Na; Eunhye Lee; Kyung‐Ho Park; Dongwoo Lee; Tae‐Ik Lee. Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging. Advanced Materials Technologies. 2024-11-02. https://doi.org/10.1002/admt.202401184