Cracking in semiconductor devices–effect of plasticity under triaxial constraint
Sammy Hassan; Jyun-Lin Wu; Jason Lan; Sherwin Tang; Jun He; Joost J. Vlassak; Zhigang Suo
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Journal of the Mechanics and Physics of Solids
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.jmps.2024.105856
The original publisher provides the full text and its access options.
Cite this source
Sammy Hassan; Jyun-Lin Wu; Jason Lan; Sherwin Tang; Jun He; Joost J. Vlassak; Zhigang Suo. Cracking in semiconductor devices–effect of plasticity under triaxial constraint. Journal of the Mechanics and Physics of Solids. 2024-12. https://doi.org/10.1016/j.jmps.2024.105856