Performance Envelope Enabled by CVD Diamond Heatspreader Integration in Semiconductor Chips
Shye Shapira; Nir Nirenberg
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/comcas58210.2024.10666214
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Cite this source
Shye Shapira; Nir Nirenberg. Performance Envelope Enabled by CVD Diamond Heatspreader Integration in Semiconductor Chips. 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS). 2024-07-09. https://doi.org/10.1109/comcas58210.2024.10666214