Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs
Jeong-Hyeon Park; Hwanjoo Park; Taehwan Kim; Jaechoon Kim; Eun-Ho Lee
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Applied Mathematical Modelling
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.apm.2024.02.034
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Cite this source
Jeong-Hyeon Park; Hwanjoo Park; Taehwan Kim; Jaechoon Kim; Eun-Ho Lee. Numerical analysis of thermal and mechanical characteristics with property maps in complex semiconductor package designs. Applied Mathematical Modelling. 2024-06. https://doi.org/10.1016/j.apm.2024.02.034