Towards zero defects: machine learning-driven solder bump reliability in semiconductor packaging
Himanandhan Reddy Kottur; Liton Kumar Biswas; Nitin Varshney; Shajib Ghosh; Navid Asadizanjani
- Published
- Publisher
- SPIE
- Journal / collection
- Metrology, Inspection, and Process Control XXXIX
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.1117/12.3060363
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Cite this source
Himanandhan Reddy Kottur; Liton Kumar Biswas; Nitin Varshney; Shajib Ghosh; Navid Asadizanjani. Towards zero defects: machine learning-driven solder bump reliability in semiconductor packaging. Metrology, Inspection, and Process Control XXXIX. 2025-04-24. https://doi.org/10.1117/12.3060363