Using statistical models for optimal packaging in semiconductor manufacturing processes
Dongguen Kim; Heejin Kim; Yejin Kim; Minwoo Chae; Young Myoung Ko; Young-Mok Bae; Hyungsub Sim; Young Chan Oh; Keum Hwan Noh
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Journal of the Korean Statistical Society
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s42952-024-00284-1
The original publisher provides the full text and its access options.
Cite this source
Dongguen Kim; Heejin Kim; Yejin Kim; Minwoo Chae; Young Myoung Ko; Young-Mok Bae; Hyungsub Sim; Young Chan Oh; Keum Hwan Noh. Using statistical models for optimal packaging in semiconductor manufacturing processes. Journal of the Korean Statistical Society. 2024-08-07. https://doi.org/10.1007/s42952-024-00284-1