High-Precision Infrared-Light Interferometry for Accurate Overlay and Alignment in Three-Dimensional Semiconductor Packaging
Soobong Choi; Jaeseung Im; Hyuntae Kim; Byung-Woon Ahn; Ah-Jin Jo
- Published
- Publisher
- Elsevier BV
- Research area
- Semiconductors
- Source type
- Preprint / posted paper
- DOI
- 10.2139/ssrn.5340559
This is a preprint or other posted paper. Check the original source for its review and publication status.
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Cite this source
Soobong Choi; Jaeseung Im; Hyuntae Kim; Byung-Woon Ahn; Ah-Jin Jo. High-Precision Infrared-Light Interferometry for Accurate Overlay and Alignment in Three-Dimensional Semiconductor Packaging. Elsevier BV. 2025. https://doi.org/10.2139/ssrn.5340559