Deep Learning-Based Detection of Defects in Wafer Buffer Zone During Semiconductor Packaging Process
Tae-Yeon Kim; Sunjae Park; Chang-Kue Lim; Jae-Hyuk Choi; Chang-Hyun An; Lak-Hyun Song; Do-Nyun Kim
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Multiscale Science and Engineering
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.1007/s42493-024-00103-z
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Cite this source
Tae-Yeon Kim; Sunjae Park; Chang-Kue Lim; Jae-Hyuk Choi; Chang-Hyun An; Lak-Hyun Song; Do-Nyun Kim. Deep Learning-Based Detection of Defects in Wafer Buffer Zone During Semiconductor Packaging Process. Multiscale Science and Engineering. 2024-02-14. https://doi.org/10.1007/s42493-024-00103-z