Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
Moses Gu; Hyunjin Nam; Sehoon Park; Minkyung Shin; Sung-Hoon Choa
- Published
- Publisher
- MDPI AG
- Journal / collection
- Materials
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.3390/ma17215142
The original publisher provides the full text and its access options.
Cite this source
Moses Gu; Hyunjin Nam; Sehoon Park; Minkyung Shin; Sung-Hoon Choa. Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications. Materials. 2024-10-22. https://doi.org/10.3390/ma17215142