Constructing Financial Support Ecosystem of Innovation Momentum for Semiconductor Industry
Tsung-Han Ke; Hung-Chun Huang; Hsin-Yu Shih
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 Portland International Conference on Management of Engineering and Technology (PICMET)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/picmet64035.2024.10653367
The original publisher provides the full text and its access options.
Cite this source
Tsung-Han Ke; Hung-Chun Huang; Hsin-Yu Shih. Constructing Financial Support Ecosystem of Innovation Momentum for Semiconductor Industry. 2024 Portland International Conference on Management of Engineering and Technology (PICMET). 2024-08-04. https://doi.org/10.23919/picmet64035.2024.10653367