Recent Progress of TGV Technology for High Performance Semiconductor Packaging
Beom Chang Seok; Jae Pil Jung
- Published
- Publisher
- The Korean Welding and Joining Society
- Journal / collection
- Journal of Welding and Joining
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.5781/jwj.2024.42.2.2
The original publisher provides the full text and its access options.
Cite this source
Beom Chang Seok; Jae Pil Jung. Recent Progress of TGV Technology for High Performance Semiconductor Packaging. Journal of Welding and Joining. 2024-04-30. https://doi.org/10.5781/jwj.2024.42.2.2