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Research literature / Conference paper

Reliability and Failure Mechanisms of Direct Bonded Power Semiconductor Devices in Power Cycling Test

Marius Köhler; Michael Curkin; Christian Thomas; Nicolas Heuck; Jens Müller; Kurt-Georg Besendörfer

Published
Publisher
IEEE
Journal / collection
2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/ispsd59661.2024.10579636

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Marius Köhler; Michael Curkin; Christian Thomas; Nicolas Heuck; Jens Müller; Kurt-Georg Besendörfer. Reliability and Failure Mechanisms of Direct Bonded Power Semiconductor Devices in Power Cycling Test. 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD). 2024-06-02. https://doi.org/10.1109/ispsd59661.2024.10579636

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