PFAS free die attach for robust manufacturability of large body semiconductor packages
Avin Dhoble; Senthil Kanagavel; Elisia Siow
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iemt61324.2024.10875255
The original publisher provides the full text and its access options.
Cite this source
Avin Dhoble; Senthil Kanagavel; Elisia Siow. PFAS free die attach for robust manufacturability of large body semiconductor packages. 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT). 2024-10-16. https://doi.org/10.1109/iemt61324.2024.10875255