Innovating Semiconductor Packaging: Dynamic Finite Element Models and Steady-State Warpage Simulations
Mei-Ling Wu; Wei-Jhih Wong
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tcpmt.2024.3454639
The original publisher provides the full text and its access options.
Cite this source
Mei-Ling Wu; Wei-Jhih Wong. Innovating Semiconductor Packaging: Dynamic Finite Element Models and Steady-State Warpage Simulations. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2025-01. https://doi.org/10.1109/tcpmt.2024.3454639