Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability
Jinxiao Wei; Jinpeng Cheng; Yuxiang Chen; Li Ran; Hao Feng; Homer Alan Mantooth; Frede Blaabjerg; Xu Zhang; Sudharsan Chinnaiyan; Philip A. Mawby
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/jestpe.2025.3540294
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Cite this source
Jinxiao Wei; Jinpeng Cheng; Yuxiang Chen; Li Ran; Hao Feng; Homer Alan Mantooth; Frede Blaabjerg; Xu Zhang; Sudharsan Chinnaiyan; Philip A. Mawby. Substrate-Less Power Semiconductor Packaging for the Potential of Recyclability. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2025-04. https://doi.org/10.1109/jestpe.2025.3540294