Study on thermal elastic damping of micro-scale semiconductor beams
Shaofan Yang; Yaqin Song; Sen Gu; Zhimin Hou
- Published
- Publisher
- Springer Science and Business Media LLC
- Journal / collection
- Acta Mechanica
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1007/s00707-024-03957-4
The original publisher provides the full text and its access options.
Cite this source
Shaofan Yang; Yaqin Song; Sen Gu; Zhimin Hou. Study on thermal elastic damping of micro-scale semiconductor beams. Acta Mechanica. 2024-05-19. https://doi.org/10.1007/s00707-024-03957-4