Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition
G. Janod; L. Chachay; J. Schoenleber; Y. Avenas; D. Bouvard; R. Daudin; J.-M. Missiaen; M.-P. Gigandet; J.-Y. Hihn; R. Khazaka
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Microelectronics Reliability
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.microrel.2025.115648
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Cite this source
G. Janod; L. Chachay; J. Schoenleber; Y. Avenas; D. Bouvard; R. Daudin; J.-M. Missiaen; M.-P. Gigandet; J.-Y. Hihn; R. Khazaka. Evaluation and thermal ageing of power semiconductor die attachments based on porous film electrodeposition. Microelectronics Reliability. 2025-04. https://doi.org/10.1016/j.microrel.2025.115648