Skip to content
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Journal article

Review on the Thermal Models Applications in the Reliability of Power Semiconductor Device

Jun Zhang; Huixian Shen; Haiyan Sun; Zhihuan Wang

Published
Publisher
Institution of Engineering and Technology (IET)
Journal / collection
IET Power Electronics
Research area
Semiconductors
Source type
Journal article
DOI
10.1049/pel2.70065

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Jun Zhang; Huixian Shen; Haiyan Sun; Zhihuan Wang. Review on the Thermal Models Applications in the Reliability of Power Semiconductor Device. IET Power Electronics. 2025-01. https://doi.org/10.1049/pel2.70065

Download RIS