Stacking ensemble learning based material removal rate prediction model for CMP process of semiconductor wafer
Zhilong Song; Wenhong Zhao; Xiao Zhang; Mingfeng Ke; Wei Fang; Binghai Lyu
- Published
- Publisher
- Cambridge University Press (CUP)
- Journal / collection
- Artificial Intelligence for Engineering Design, Analysis and Manufacturing
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1017/s0890060424000167
The original publisher provides the full text and its access options.
Cite this source
Zhilong Song; Wenhong Zhao; Xiao Zhang; Mingfeng Ke; Wei Fang; Binghai Lyu. Stacking ensemble learning based material removal rate prediction model for CMP process of semiconductor wafer. Artificial Intelligence for Engineering Design, Analysis and Manufacturing. 2024. https://doi.org/10.1017/s0890060424000167