Silver-containing paste for low-temperature connection of elements of power semiconductor devices
Konstantin N. Nishchev; Mikhail I. Novopoltsev; Sergey G. Kostryukov; Aleksandr A. Pynenkov; Nikolai V. Moiseev
- Published
- Publisher
- Penza State University
- Journal / collection
- University proceedings. Volga region. Physical and mathematical sciences
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.21685/2072-3040-2025-4-10
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Cite this source
Konstantin N. Nishchev; Mikhail I. Novopoltsev; Sergey G. Kostryukov; Aleksandr A. Pynenkov; Nikolai V. Moiseev. Silver-containing paste for low-temperature connection of elements of power semiconductor devices. University proceedings. Volga region. Physical and mathematical sciences. 2025. https://doi.org/10.21685/2072-3040-2025-4-10