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Research literature / Conference paper

Practical Interpretation of Die Crack Origin in Semiconductor Packages Using Multi-Mode Scanning Acoustic Microscopy with B-Scan and TAMI Analysis

Esther Lim Kean Poh

Published
Publisher
ASM International
Journal / collection
International Symposium for Testing and Failure Analysis
Research area
Semiconductors
Source type
Conference paper
DOI
10.31399/asm.cp.istfa2026p0539

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Esther Lim Kean Poh. Practical Interpretation of Die Crack Origin in Semiconductor Packages Using Multi-Mode Scanning Acoustic Microscopy with B-Scan and TAMI Analysis. International Symposium for Testing and Failure Analysis. 2026-10-04. https://doi.org/10.31399/asm.cp.istfa2026p0539

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