Strain as the Common Language of Advanced Semiconductor Packaging
Pawel Nowakowski; Richard Wei-Chih Li; Paul Fischione
- Published
- Publisher
- ASM International
- Journal / collection
- International Symposium for Testing and Failure Analysis
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.31399/asm.cp.istfa2026p0744
The original publisher provides the full text and its access options.
Cite this source
Pawel Nowakowski; Richard Wei-Chih Li; Paul Fischione. Strain as the Common Language of Advanced Semiconductor Packaging. International Symposium for Testing and Failure Analysis. 2026-10-04. https://doi.org/10.31399/asm.cp.istfa2026p0744