An Innovative Hybrid Cleaning Approach for Contaminant Removal in Semiconductor Packaging
Chun Yuan Lim; Meng Kong Heng; Mee Sing Tiong; Kwang Jun Lee
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iemt61324.2024.10875246
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Cite this source
Chun Yuan Lim; Meng Kong Heng; Mee Sing Tiong; Kwang Jun Lee. An Innovative Hybrid Cleaning Approach for Contaminant Removal in Semiconductor Packaging. 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT). 2024-10-16. https://doi.org/10.1109/iemt61324.2024.10875246