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Research literature / Conference paper

Enabling overloadability in power semiconductor modules by pulsating heat pipe coolers

Reza Soleimanzadeh; Yanfei Zhao; Marcel Fuchs

Published
Publisher
IEEE
Journal / collection
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/therminic62015.2024.10732153

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Reza Soleimanzadeh; Yanfei Zhao; Marcel Fuchs. Enabling overloadability in power semiconductor modules by pulsating heat pipe coolers. 2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). 2024-09-25. https://doi.org/10.1109/therminic62015.2024.10732153

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