Impact of Thermal Interface Materials on the Device Thermal Coupling in Semiconductor Power Modules
Xiang Li; Guiqin Chang; Matthew Packwood; Qiang Xiao; Haihui Luo; Guoyou Liu
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Power Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tpel.2024.3486990
The original publisher provides the full text and its access options.
Cite this source
Xiang Li; Guiqin Chang; Matthew Packwood; Qiang Xiao; Haihui Luo; Guoyou Liu. Impact of Thermal Interface Materials on the Device Thermal Coupling in Semiconductor Power Modules. IEEE Transactions on Power Electronics. 2025-02. https://doi.org/10.1109/tpel.2024.3486990