A Method for Semiconductor Electro-Thermal Coupling with Spectral-Element Method Solver
Hao Liu; Chunyu Li; Tiancheng Zhang; Huaguang Bao; Dazhi Ding
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/imws-amp62793.2024.10966623
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Cite this source
Hao Liu; Chunyu Li; Tiancheng Zhang; Huaguang Bao; Dazhi Ding. A Method for Semiconductor Electro-Thermal Coupling with Spectral-Element Method Solver. 2024 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). 2024-11-09. https://doi.org/10.1109/imws-amp62793.2024.10966623