Low Dielectric Materials for High Frequency Semiconductor Packaging Application
Meei-Yu Hsu; Chih-Hao Lin; Kai-Chi Chen
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 International Conference on Electronics Packaging (ICEP)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep61562.2024.10535560
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Cite this source
Meei-Yu Hsu; Chih-Hao Lin; Kai-Chi Chen. Low Dielectric Materials for High Frequency Semiconductor Packaging Application. 2024 International Conference on Electronics Packaging (ICEP). 2024-04-17. https://doi.org/10.23919/icep61562.2024.10535560