SiC Die Attach Based on Sintered for Wide Band Gap Semiconductor
Koyo Kobori
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.94311
The original publisher provides the full text and its access options.
Cite this source
Koyo Kobori. SiC Die Attach Based on Sintered for Wide Band Gap Semiconductor. IMAPSource Proceedings. 2024-02-23. https://doi.org/10.4071/001c.94311