An HTRB Tester with A Novel Heating System for TO-247 Packaged Power Semiconductor Devices
Junhong Tong; Qingxuan Ma; Alex Q. Huang
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE Energy Conversion Congress and Exposition (ECCE)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/ecce55643.2024.10860849
The original publisher provides the full text and its access options.
Cite this source
Junhong Tong; Qingxuan Ma; Alex Q. Huang. An HTRB Tester with A Novel Heating System for TO-247 Packaged Power Semiconductor Devices. 2024 IEEE Energy Conversion Congress and Exposition (ECCE). 2024-10-20. https://doi.org/10.1109/ecce55643.2024.10860849