Closing Test Coverage Gaps in High-Volume Semiconductor Manufacturing: A Debug Methodology Leveraging Failure Analysis
Shen Shen Lee; Lay Lay Goh; Jiajun Wu
- Published
- Publisher
- ASM International
- Journal / collection
- International Symposium for Testing and Failure Analysis
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.31399/asm.cp.istfa2026p0527
The original publisher provides the full text and its access options.
Cite this source
Shen Shen Lee; Lay Lay Goh; Jiajun Wu. Closing Test Coverage Gaps in High-Volume Semiconductor Manufacturing: A Debug Methodology Leveraging Failure Analysis. International Symposium for Testing and Failure Analysis. 2026-10-04. https://doi.org/10.31399/asm.cp.istfa2026p0527