Volumetric nondestructive metrology for 3D semiconductor packaging: A review
Yutai Su; Jing Shi; Yuan-Ming Hsu; Dai-Yan Ji; Alexander David Suer; Jay Lee
- Published
- Publisher
- Elsevier BV
- Journal / collection
- Measurement
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1016/j.measurement.2023.114065
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Cite this source
Yutai Su; Jing Shi; Yuan-Ming Hsu; Dai-Yan Ji; Alexander David Suer; Jay Lee. Volumetric nondestructive metrology for 3D semiconductor packaging: A review. Measurement. 2024-02. https://doi.org/10.1016/j.measurement.2023.114065