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Research literature / Conference paper

Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect

Yasuhiro Morikawa

Published
Publisher
IEEE
Journal / collection
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/cstic61820.2024.10532090

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Yasuhiro Morikawa. Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect. 2024 Conference of Science and Technology for Integrated Circuits (CSTIC). 2024-03-17. https://doi.org/10.1109/cstic61820.2024.10532090

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