Skip to content
Independent research & intelligence
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Conference paper

Backside Deprocessing of Integrated Circuits for Digital Forensic Analysis

Tibbe van der Biezen; Aya Fukami; Kees Schot; Aurelija Mockute; Thomas Lindström; Björn Ärleskog

Published
Publisher
ASM International
Journal / collection
International Symposium for Testing and Failure Analysis
Research area
Semiconductors
Source type
Conference paper
DOI
10.31399/asm.cp.istfa2026p0493

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

Tibbe van der Biezen; Aya Fukami; Kees Schot; Aurelija Mockute; Thomas Lindström; Björn Ärleskog. Backside Deprocessing of Integrated Circuits for Digital Forensic Analysis. International Symposium for Testing and Failure Analysis. 2026-10-04. https://doi.org/10.31399/asm.cp.istfa2026p0493

Download RIS