Skip to content
OPEN VARIABLE

Evidence-First Signal Intelligence

Menu

Research literature / Journal article

FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules

N. Delmonte; D. Spaggiari; C. Sciancalepore; R. Menozzi; P. Cova

Published
Publisher
Elsevier BV
Journal / collection
Microelectronics Reliability
Research area
Semiconductors
Source type
Journal article
DOI
10.1016/j.microrel.2025.115671

Read the original source ↗

The original publisher provides the full text and its access options.

Cite this source

N. Delmonte; D. Spaggiari; C. Sciancalepore; R. Menozzi; P. Cova. FEM-based development of novel 3D-printable plastic direct coolers for power semiconductor modules. Microelectronics Reliability. 2025-04. https://doi.org/10.1016/j.microrel.2025.115671

Download RIS