Overview of Testing Methods for Mechanical and Adhesion Properties of Materials in Semiconductor Packages
Seung Jin Oh; Jae Hak Lee; Seung Man Kim; Seongheum Han; Ah-Young Park; Hyunkyu Moon; Jun-Yeob Song
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Materials for Electron Devices
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/tmat.2025.3561740
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Cite this source
Seung Jin Oh; Jae Hak Lee; Seung Man Kim; Seongheum Han; Ah-Young Park; Hyunkyu Moon; Jun-Yeob Song. Overview of Testing Methods for Mechanical and Adhesion Properties of Materials in Semiconductor Packages. IEEE Transactions on Materials for Electron Devices. 2025. https://doi.org/10.1109/tmat.2025.3561740