A Power Grid Electromigration Test Chip for Lifetime Characterization and Model Calibration
Yong Hyeon Yi; Robert Bloom; Armen Kteyan; Alexander Volkov; Jun-Ho Choy; Stephane Moreau; Valeriy Sukharev; Chris H. Kim
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Transactions on Device and Materials Reliability
- Research area
- Energy & infrastructure
- Source type
- Journal article
- DOI
- 10.1109/tdmr.2025.3560489
The original publisher provides the full text and its access options.
Cite this source
Yong Hyeon Yi; Robert Bloom; Armen Kteyan; Alexander Volkov; Jun-Ho Choy; Stephane Moreau; Valeriy Sukharev; Chris H. Kim. A Power Grid Electromigration Test Chip for Lifetime Characterization and Model Calibration. IEEE Transactions on Device and Materials Reliability. 2025-06. https://doi.org/10.1109/tdmr.2025.3560489