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Thermal Stress Effects on Quantum Transport in Gate-All-Around Nanosheet Field Effect Transistor in 3D Heterogeneously Integrated Circuits

Yizhang Liu; Wenchao Chen; Shuo Zhang; Liang Tian; Erping Li

Published
Publisher
IEEE
Journal / collection
2024 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)
Research area
Semiconductors
Source type
Conference paper
DOI
10.1109/rfit60557.2024.10812567

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Yizhang Liu; Wenchao Chen; Shuo Zhang; Liang Tian; Erping Li. Thermal Stress Effects on Quantum Transport in Gate-All-Around Nanosheet Field Effect Transistor in 3D Heterogeneously Integrated Circuits. 2024 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT). 2024-08-28. https://doi.org/10.1109/rfit60557.2024.10812567

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