Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects
Nien-Chun Lin; Hsin-Chih Shih; Ching-I Tsai; Chin-Li Kao; Chen-Chao Wang; C.P. Hung
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 International Conference on Electronics Packaging (ICEP)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.23919/icep61562.2024.10535603
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Cite this source
Nien-Chun Lin; Hsin-Chih Shih; Ching-I Tsai; Chin-Li Kao; Chen-Chao Wang; C.P. Hung. Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects. 2024 International Conference on Electronics Packaging (ICEP). 2024-04-17. https://doi.org/10.23919/icep61562.2024.10535603