Application of Artificial Intelligence to Improve Chip Defect Detection Using Semiconductor Equipment
Chung-Jen Fu; Hsuan-Lin Chen; Huo-Yen Tseng
- Published
- Publisher
- MDPI
- Journal / collection
- 2024 4th International Conference on Social Sciences and Intelligence Management (SSIM 2024)
- Research area
- AI & compute
- Source type
- Conference paper
- DOI
- 10.3390/engproc2025098026
The original publisher provides the full text and its access options.
Cite this source
Chung-Jen Fu; Hsuan-Lin Chen; Huo-Yen Tseng. Application of Artificial Intelligence to Improve Chip Defect Detection Using Semiconductor Equipment. 2024 4th International Conference on Social Sciences and Intelligence Management (SSIM 2024). 2025-06-30. https://doi.org/10.3390/engproc2025098026