Evaluation of Warpage Deformation in Semiconductor Device Packaging Process
Taiju Yagi; Qiang Yu; Haruyuki Shimada; Yuichi Yanaka; Takashi Masuko
- Published
- Publisher
- American Society of Mechanical Engineers
- Journal / collection
- ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1115/ipack2024-140852
The original publisher provides the full text and its access options.
Cite this source
Taiju Yagi; Qiang Yu; Haruyuki Shimada; Yuichi Yanaka; Takashi Masuko. Evaluation of Warpage Deformation in Semiconductor Device Packaging Process. ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. 2024-10-08. https://doi.org/10.1115/ipack2024-140852