Semiconductor Laser Packaging Technology: Thermal Management, Optical Performance Enhancement, and Reliability Studies
Tianqi Wu; Jichen Shen; Jun Zou; Peng Wu; Yitao Liao
- Published
- Publisher
- Bon View Publishing Pte
- Journal / collection
- Journal of Optics and Photonics Research
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.47852/bonviewjopr42022985
The original publisher provides the full text and its access options.
Cite this source
Tianqi Wu; Jichen Shen; Jun Zou; Peng Wu; Yitao Liao. Semiconductor Laser Packaging Technology: Thermal Management, Optical Performance Enhancement, and Reliability Studies. Journal of Optics and Photonics Research. 2024-11-26. https://doi.org/10.47852/bonviewjopr42022985