Multiscale simulation study on the mechanical, electrical, and thermal properties of ZnSb semiconductor
Shihui Chen; Hanwen Yang; Guang Yang; Minghui Cheng; Zipei Zhang; Zhangfeng Wu; Jianping Lin
- Published
- Publisher
- Royal Society of Chemistry (RSC)
- Journal / collection
- Journal of Materials Chemistry C
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1039/d5tc01764e
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Cite this source
Shihui Chen; Hanwen Yang; Guang Yang; Minghui Cheng; Zipei Zhang; Zhangfeng Wu; Jianping Lin. Multiscale simulation study on the mechanical, electrical, and thermal properties of ZnSb semiconductor. Journal of Materials Chemistry C. 2025. https://doi.org/10.1039/d5tc01764e