Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration Assembly
Glenn Farris
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.129617
The original publisher provides the full text and its access options.
Cite this source
Glenn Farris. Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration Assembly. IMAPSource Proceedings. 2025-02-10. https://doi.org/10.4071/001c.129617