Energy Saving in Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization
Arieff Yusoff
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/iemt61324.2024.10875094
The original publisher provides the full text and its access options.
Cite this source
Arieff Yusoff. Energy Saving in Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization. 2024 IEEE 40th International Electronics Manufacturing Technology (IEMT). 2024-10-16. https://doi.org/10.1109/iemt61324.2024.10875094