WBG Power Semiconductor Module Packaging Insulation Characteristics Under Electrothermal Stress
Wei Liu; Jun Jiang; Yue Wang; Junzhe Zhang; Xuefeng Duan; Renli Fu; Chaohai Zhang
- Published
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Journal / collection
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.1109/jestpe.2024.3507821
The original publisher provides the full text and its access options.
Cite this source
Wei Liu; Jun Jiang; Yue Wang; Junzhe Zhang; Xuefeng Duan; Renli Fu; Chaohai Zhang. WBG Power Semiconductor Module Packaging Insulation Characteristics Under Electrothermal Stress. IEEE Journal of Emerging and Selected Topics in Power Electronics. 2025-02. https://doi.org/10.1109/jestpe.2024.3507821