Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device
Huixian Shen; Jun Zhang; Pengju Sun; Xing Ma
- Published
- Publisher
- IEEE
- Journal / collection
- 2024 IEEE 7th International Electrical and Energy Conference (CIEEC)
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1109/cieec60922.2024.10583571
The original publisher provides the full text and its access options.
Cite this source
Huixian Shen; Jun Zhang; Pengju Sun; Xing Ma. Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device. 2024 IEEE 7th International Electrical and Energy Conference (CIEEC). 2024-05-10. https://doi.org/10.1109/cieec60922.2024.10583571