Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor Packaging
Navid Kazem
- Published
- Publisher
- IMAPS - International Microelectronics Assembly and Packaging Society
- Journal / collection
- IMAPSource Proceedings
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.4071/001c.116535
The original publisher provides the full text and its access options.
Cite this source
Navid Kazem. Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor Packaging. IMAPSource Proceedings. 2024-04-12. https://doi.org/10.4071/001c.116535