Study on the Stiffness Derivation for Air Bearing Systems in Semiconductor Wafer Grinding
School of Mechanical Design Engineering, CWNU UNIV; Min-Seong Park; Won-Jee Chung; Sung-Woo Shin; Bo-Gyeong Jeong; Eui-Young Song; Dong-Gun Kim
- Published
- Publisher
- The Korean Society of Manufacturing Process Engineers
- Journal / collection
- Journal of the Korean Society of Manufacturing Process Engineers
- Research area
- Semiconductors
- Source type
- Journal article
- DOI
- 10.14775/ksmpe.2024.23.08.062
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Cite this source
School of Mechanical Design Engineering, CWNU UNIV; Min-Seong Park; Won-Jee Chung; Sung-Woo Shin; Bo-Gyeong Jeong; Eui-Young Song; Dong-Gun Kim. Study on the Stiffness Derivation for Air Bearing Systems in Semiconductor Wafer Grinding. Journal of the Korean Society of Manufacturing Process Engineers. 2024-08-30. https://doi.org/10.14775/ksmpe.2024.23.08.062