Predicting Work-in-Process in Semiconductor Packaging Using Neural Networks: Technical Evaluation and Future Applications
Chin-Ta Wu; Shing-Han Li; David C. Yen
- Published
- Publisher
- MDPI AG
- Journal / collection
- Electronics
- Research area
- AI & compute
- Source type
- Journal article
- DOI
- 10.3390/electronics13214275
The original publisher provides the full text and its access options.
Cite this source
Chin-Ta Wu; Shing-Han Li; David C. Yen. Predicting Work-in-Process in Semiconductor Packaging Using Neural Networks: Technical Evaluation and Future Applications. Electronics. 2024-10-31. https://doi.org/10.3390/electronics13214275