AI-enhanced optical critical dimension metrology for high aspect ratio structures in semiconductor advanced packaging
Fu-Sheng Yang; Min-Ru Wu; Yen-Hung Hung; Zih-Ying Fu; Liang-Chia Chen
- Published
- Publisher
- SPIE
- Journal / collection
- Novel Patterning Technologies 2024
- Research area
- Semiconductors
- Source type
- Conference paper
- DOI
- 10.1117/12.3012984
The original publisher provides the full text and its access options.
Cite this source
Fu-Sheng Yang; Min-Ru Wu; Yen-Hung Hung; Zih-Ying Fu; Liang-Chia Chen. AI-enhanced optical critical dimension metrology for high aspect ratio structures in semiconductor advanced packaging. Novel Patterning Technologies 2024. 2024-04-09. https://doi.org/10.1117/12.3012984